Samsung starts mass producing Embedded Multi-Chip Memory for entry-level smartphones

Samsung has started mass production of Embedded Multi-Chip package (eMCP) memory to cater to the rising demand of entry and mid-level smartphones. The new eMCPs use Samsung’s 30nm-based LPDDR2 RAMs that deliver a data transmission speed of 1066Mbps and 20nm-class NAND flash memory.

Samsung says the new eMCP solution will help to deliver enhanced performance and a longer battery life, thus giving mobile phone manufacturers a simpler design process.

The new eMCP solution will come with 4GB of NAND flash memory along with choice of 256MB, 512MB, 768MB RAM.